


These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Color
White
Specific Gravity
2.37
Viscosity/Flowability
Nonflowing
Thermal Conductivity
0.8 watts/meter- °C
Volume Resistivity
5.0 x 1015
Dielectric Constant
4.4 at 100k Hz
Dissipation Factor
0.02 at 100k Hz
Dielectric Strength
550 volts/mil; 21.7 kV/mm
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